Scientists at IBM's Zurich Research Laboratory have developed a glue-application technique used to assemble chips that will <A HREF="http://www.cio.com/blog_view.html?CID=32656">keep them running cooler,</A> the company said.

Glues are used to bind the semiconductor packages, such as microprocessors and chipsets, with cooling elements that disperse the heat generated by today's powerful chips. However, current glues, which are embedded with microscopic particles of metal or ceramics to help transfer heat, continue to be an obstacle to efficient heat dissipation, IBM said.