Researchers at IBM have come up with a way to <A HREF="http://news.zdnet.com/2100-9584_22-6180994.html?tag=nl.e589">create vacuum spaces</A> between copper wires in semiconductors, an insulating technique that will allow these chips to increase in speed and performance and reduce power consumption. Early indications show that chip performance can be increased by up to 35 percent, power consumption can be cut by 15 percent, or some combination of increased performance and power savings can be achieved.

The vacuum technique, called Airgap, will be introduced to IBM's manufacturing process with the 32-nanometer generation of microprocessors, said IBM fellow Dan Edelstein, who led the project. These chips will start rolling out in 2009.